The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical. Study the effect of thermal stress on resonant frequency. • Eigen Frequency Analysis with & without thermal stresses. • Change design to minimize the effect of.
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You can include a variety of damping phenomena in your model: The model estimates how much current and increase in The measurement of S-parameter is commonly used to characterize such devices for RF applications. Piezoelectric valves are frequently employed in medical and laboratory applications due to their fast response times and quiet operation.
This model shows the bending of a cantilever beam under an applied electrostatic load. It is typically quite small, and arrays This model shows how to analyze a tuning fork based tutoril rate gyroscope. Composite Piezoelectric Transducer This example shows how to set up a piezoelectric transducer problem following the work of Y.
The MEMS Module can be used for Joule heating with thermal stress simulations that include details of the distribution of resistive losses. Thermoelastic damping is an important factor when designing MEMS resonators.
The model solves the deformation of the beam under an applied voltage. Simulation of Microelectromechanical Systems The design and modeling of microelectromechanical systems MEMS is a unique engineering discipline.
Popularity Popularity Date Published. Composite Piezoelectric Transducer This example shows how to set up a piezoelectric transducer problem following the work of Y.
This model shows the bending of a cantilever beam under an applied electrostatic load. This model simulates the mechanism of a valveless micropump, that is designed to be effective at low Reynolds numbers, overcoming hydrodynamic Once the geometry model is defined, the next step is to comsll appropriate materials and add a suitable physics interface.
,ems Gas Damping of a Vibrating Disc This benchmark model computes the total force acting on a vibrating disc in the frequency and time domains and compares both results with expressions derived analytically.
These interfaces can be used to model squeeze film and slide film damping across a wide range of pressures rarefaction effects can be included. By talking to one of our sales representatives, you will get personalized recommendations and fully documented examples to help you get the most out tutorila your evaluation and guide you to choose the best license option to suit your needs.
Thermal Initial Stresses in a Layered Plate The thermal stress in a layered plate is studied in this example.
A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at degrees C. This example shows how to set up a piezoelectric transducer problem following the work of Y. This example explores the shift in natural frequencies caused by changing the temperature. You can extend the material models with thermal expansion, damping, and initial stress and strain features.
Electrostatic forces scale favorably as the device dimensions are reduced, a fact frequently leveraged in MEMS.
This 2D axisymmetry model uses a parametric sweep of voltage to Furthermore, piezoelectric sensors and actuators are predominantly linear and do not consume DC power in operation.
Microvisk Technologies develops and manufactures devices for measuring blood viscosity using the power of Micro Electronic Mechanical Systems MEMS and a radical new technique stemming from futuristic research on microtechnology.
A capacitive pressure sensor is simulated. Thermal actuators are also easy to integrate with semiconductor processes, although they usually consume large amounts of power compared to their electrostatic and piezoelectric counterparts.
The stress field in a piezoresitive sensor computed with the built-in physics interface for piezoresistive materials in the MEMS Module.
MEMS Software – For Microelectromechanical Systems Simulation
The composite piezoelectric ultrasonic transducer has a cylindrical geometry that consists of a piezoceramic layer, two aluminum layers, and two adhesive layers. Eigenfrequency Shifts Caused by Temperature Changes This example explores the shift in natural frequencies caused by changing the temperature. The MEMS module has specialized thin film damping physics interfaces which solve the Reynolds equation to determine the fluid velocity and pressure and the forces on the adjacent surfaces.
This model shows how to create dispersion diagrams from simulation results by extending the tutorial Thin-Film BAW Composite Resonator. In addition, several sources of initial strains are allowed, making it possible to include arbitrary inelastic strain contributions stemming from multiple physical sources. Search for tutorials and apps relevant to your area of expertise via the Quick Search feature.